ALL PROCESSES

Soldering Technologies

Convection conveyor ovens, vapor phase ovens, contact soldering, and conformal coating. Range from -50 to 1100 °C.

CONVECTION · ~250°C

Convection Soldering

Heat transfer from a heater to a PCB through hot air circulation. The most common reflow soldering method.

VAPOR PHASE · ~230°C

Soldering in inert liquid vapor. Maximum temperature uniformity across the entire PCB surface.

CONTACT · ~350°C

Direct heater contact with the board. High speed and accuracy for large components and connectors.

COATING · ~25°C

Applying protective coatings on PCBs to prevent moisture, dust, and chemical exposure.

CONTACTLESS · ~250°C

Infrared and laser soldering without physical contact. Ideal for sensitive and miniature components.

REEL-TO-REEL · ~300°C

IR soldering on flexible substrates for LED strip and flex circuit production.

DRYING · 50-200°C

IR drying, UV curing, conformal coating drying, and adhesive curing. Temperature range 50–200 °C.

SPECIAL · -50...1100°C

Laser annealing for solar panels, combined thermal profiles, and specialized high-temperature processes.