Vapor Phase Soldering

Vapor phase soldering (VPS) uses the condensation energy of an inert liquid to heat the PCB assembly. The board is lowered into the vapor zone where the liquid condenses on the cooler surfaces, transferring heat with maximum uniformity.

The maximum temperature is physically limited by the boiling point of the liquid (typically 230°C for lead-free), making overheating impossible. This guarantees void-free, high-reliability solder joints.

Ideal for complex assemblies with components of varying thermal mass, BGA packages, and applications requiring the highest quality standards.