Contactless Soldering

Contactless soldering uses directed infrared or laser radiation to heat solder paste to melting temperature. Unlike convection and contact methods, the heat source does not touch the board or components, minimizing mechanical and thermal stress.

No physical contact eliminates component damage. High precision of local heating allows soldering individual components. Minimal thermal stress on adjacent elements.

Ideal for repair work and prototyping. Full compatibility with lead-free solders.

Contactless soldering is used for thermally sensitive components, BGA rework, flexible PCB soldering, and prototyping. Especially demanded in aerospace and medical electronics where solder joint reliability requirements are highest.