DRYING · 50-200°C
Drying
Drying equipment covers a wide range of thermal processes: IR drying, UV curing, conformal coating drying, adhesive curing, and silicon wafer processing for photovoltaics.
Our drying ovens operate in the 50–200°C range and support multiple heating methods. Precise temperature control and uniform airflow ensure consistent results.
Applications include solder paste drying, conformal coating curing, adhesive pre-bake, and moisture removal from sensitive components before soldering.