All processes

DRYING · 50-200°C

Drying

Drying equipment covers a wide range of thermal processes: IR drying, UV curing, conformal coating drying, adhesive curing, and silicon wafer processing for photovoltaics.

Our drying ovens operate in the 50–200°C range and support multiple heating methods. Precise temperature control and uniform airflow ensure consistent results.

Applications include solder paste drying, conformal coating curing, adhesive pre-bake, and moisture removal from sensitive components before soldering.

Drying — ITEM